ALEXANDRIA, Va., Aug. 26 -- United States Patent no. D1,090,482, issued on Aug. 26, was assigned to Tymphany HK Ltd. (Tsuen Wan, Hong Kong).
"Headphone module" was invented by Tungwen Tu (Taipei, Taiwan), Chitai Ho (Taipei, Taiwan), Kehua Lin (Taipei, Taiwan) and Chiashuo Chang (Taipei, Taiwan).
The patent was filed on Jan. 9, 2024, under Application No. D/907,823.
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