ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,259, issued on Nov. 25, was assigned to TYCO FIRE & SECURITY GMBH (Neuhausen am Rheinfall, Switzerland).

"Building platform chip for digital twins" was invented by Miguel Galvez (Westford, Mass.), Richard J. Campero (Irvine, Calif.), Eric G. Lang (Milwaukee), Abu Bakr Khan (Franklin, Wis.), Donald A. Gottschalk Jr. (Racine, Wis.), Daniel M. Curtis (Franklin, Wis.), Trent M. Swanson (Wellington, Fla.) and Karl F. Reichenberger (Mequon, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method can include activating a building platform chip integrated into a building device of a building and coupled with a processing circuit of the building device....