US Patent Issued to TYCO ELECTRONICS RAYCHEM on July 29 for "Method of installing a heat shrink cover, installation kit, and installation system" (German Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,739, issued on July 29, was assigned to TYCO ELECTRONICS RAYCHEM GMBH (Ottobrunn, Germany).

"Method of installing a heat shrink cover, installation kit, and installation system" was invented by Thilo Simonsohn (Munich) and Christian Heindl (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of installing a heat shrink cover around a component includes providing the heat shrink cover having an inner sleeve and an outer sleeve, the inner sleeve is a heat shrink sleeve, and attaching an electrical heating system to an outer surface of the outer sleeve. The inner sleeve and the outer sleeve are arranged around the component, with the outer s...