US Patent Issued to Tyco Electronics (Shanghai) on April 29 for "Heat dissipation module and connector" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,159, issued on April 29, was assigned to Tyco Electronics (Shanghai) Co. Ltd. (Shanghai).

"Heat dissipation module and connector" was invented by WenYu (Vindy) Liu (Shanghai), Xingjie (Steven) Ge (Shanghai) and Xinbo (Polly) Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adja...