US Patent Issued to TXC on March 25 for "Vibration-absorbing structure for packaging a crystal resonator" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,584, issued on March 25, was assigned to TXC Corp. (Taipei, Taiwan).

"Vibration-absorbing structure for packaging a crystal resonator" was invented by Tzu-Hsiu Peng (Ping Cheng, Taiwan), Wei-Chen Lo (Ping Cheng, Taiwan) and Zong-De Lin (Ping Cheng, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vibration-absorbing structure for packaging a crystal resonator includes a package base, a resonant crystal blank, and a top cover. The top of the package base has a recess. The sidewall of the package base surrounds the recess. The resonant crystal blank has a border area, at least one serpentine connection area, and a resonant area. The serpentine...