US Patent Issued to TSLC on Sept. 23 for "Semiconductor components and semiconductor structures and methods of fabrication" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,410, issued on Sept. 23, was assigned to TSLC Corp. (Chu-nan, Taiwan).

"Semiconductor components and semiconductor structures and methods of fabrication" was invented by Trung Tri Doan (Baoshan Township, Taiwan), Chen-Fu Chu (Hsinchu, Taiwan), Shih-Kai Chan (Miaoli County, Taiwan), David Trung Doan (Baoshan Township, Hsinchu County, Taiwan) and Yi-Feng Shih (Toufen, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component for fabricating semiconductor structures includes a plate having an elastomeric polymer layer thereon and at least one semiconductor structure adhesively attached to the elastomeric polymer layer. A semicond...