US Patent Issued to TSLC on May 27 for "Method of making a packaged device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,659, issued on May 27, was assigned to TSLC Corp. (Chu-Nan, Taiwan).

"Method of making a packaged device" was invented by Chen-Fu Chu (Hsinchu, Taiwan) and Trung Tri Doan (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged LED device comprising: a pad-extended LED chip comprising: at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer; a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer; and a first extended metal layer connected to the first pad and a secon...