US Patent Issued to Tsinghua University on Sept. 9 for "Micro spectrum chip based on units of different shapes" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,393, issued on Sept. 9, was assigned to Tsinghua University (Beijing).

"Micro spectrum chip based on units of different shapes" was invented by Kaiyu Cui (Beijing), Jiawei Yang (Beijing), Yidong Huang (Beijing), Wei Zhang (Beijing), Xue Feng (Beijing) and Fang Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro spectrum chip based on units of different shapes. The micro spectrum chip includes a CIS wafer and an optical modulation layer. The optical modulation layer includes several micro-nano structure units arranged on the surface of a photosensitive area of the CIS wafer. Each micro-nano structure unit includes a plurality of micr...