ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,941, issued on Jan. 13, was assigned to TSINGHUA UNIVERSITY (Beijing).

"Preparation method for surface acoustic wave device" was invented by Feng Pan (Beijing), Rongxuan Su (Beijing), Fei Zeng (Beijing), Junyao Shen (Beijing) and Sulei Fu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are methods of preparing a Surface Acoustic Wave (SAW) device, comprising: sequentially depositing a Cu electrode, a silicon oxide film, modifying the surface of the silicon oxide film, and then depositing a piezoelectric film, and an Al electrode on a substrate having an interdigital (IDT) electrode pattern to obtain the SAW device. In some embodime...