ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,668, issued on Sept. 16, was assigned to TSE Co. LTD. (Cheonan-si, South Korea).
"Apparatus for testing semiconductor package" was invented by Dae Hyun Roh (Cheonan-si, South Korea) and Yun Chan Nam (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The objective of the present disclosure is to provide a semiconductor package test apparatus for testing a semiconductor package by means of connecting a semiconductor package and a test board. The test apparatus according to the present disclosure comprises: a conductive part mounted on a test board providing a test signal, formed at each of positions corresponding to a pad of the ...