US Patent Issued to TRUMPF PHOTONIC COMPONENTS on Dec. 9 for "Method of lithographically forming an optical structure in a semiconductor substrate" (German Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,239, issued on Dec. 9, was assigned to TRUMPF PHOTONIC COMPONENTS GMBH (Ulm, Germany).

"Method of lithographically forming an optical structure in a semiconductor substrate" was invented by Stephan Gronenborn (Aachen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an optical structure in a semiconductor substrate includes applying a layer of photoresist on a surface of the semiconductor substrate, exposing the photoresist with exposure light, and subsequently developing the photoresist. After developing, a remaining layer of the photoresist has a photoresist relief profile. The method further includes etching the photoresi...