ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,103, issued on Sept. 16, was assigned to TRON FUTURE TECH INC. (Hsinchu, Taiwan).
"Antenna package structure" was invented by Kuan-Neng Chen (Hsinchu, Taiwan), Han-Wen Hu (Hsinchu County, Taiwan), Yi-Chieh Tsai (Taoyuan, Taiwan), Yu-Jiu Wang (Hsinchu, Taiwan) and Li Han Chang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure i...