ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,589, issued on Oct. 21, was assigned to TRON FUTURE TECH INC. (Hsinchu, Taiwan).

"Antenna package and method for manufacturing an antenna package" was invented by Kuan-Neng Chen (Hsinchu, Taiwan), Han-Wen Hu (Hsinchu, Taiwan), Yu-Jiu Wang (Hsinchu, Taiwan) and Li Han Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna package is provided. The antenna package includes a glass substrate, a plurality of antennas, a multi-layer circuit structure, and a plurality of radio frequency chips. The glass substrate has a first surface and a second surface. The plurality of antennas are arranged on the first surface of the glass subs...