US Patent Issued to TRIPOD (WUXI) ELECTRONIC on Jan. 27 for "Semi-flex printed circuit board with cover-opening opening" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,436, issued on Jan. 27, was assigned to TRIPOD (WUXI) ELECTRONIC Co. LTD. (WuXi, China).

"Semi-flex printed circuit board with cover-opening opening" was invented by Cheng Ming Lu (WuXi, China), Han-Ching Shih (WuXi, China), Hsu Tu (WuXi, China), Wen-Che Chen (WuXi, China) and Wu-Chiang Ma (WuXi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the ...