US Patent Issued to TRIPOD (WUXI) ELECTRONIC on Jan. 27 for "Method for manufacturing semi-flex printed circuit board" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,430, issued on Jan. 27, was assigned to TRIPOD (WUXI) ELECTRONIC Co. LTD. (WuXi, China).

"Method for manufacturing semi-flex printed circuit board" was invented by Cheng Ming Lu (WuXi, China), Han-Ching Shih (WuXi, China), Hsu Tu (WuXi, China), Wen-Che Chen (WuXi, China) and Wu-Chiang Ma (WuXi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core sub...