US Patent Issued to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. on May 20 for "Circuit board having embedded electronic component and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,918, issued on May 20, was assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. (Shenzhen, China).

"Circuit board having embedded electronic component and method for manufacturing the same" was invented by Ming-Hsun Lee (New Taipei, Taiwan) and Chen-En Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in t...