US Patent Issued to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. on June 17 for "Photosensitive assembly having a bent shape and method for manufacturing the same, and camera module having the same" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,104, issued on June 17, was assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. (Shenzhen, China).

"Photosensitive assembly having a bent shape and method for manufacturing the same, and camera module having the same" was invented by Wen-Ching Lai (New Taipei, Taiwan), Wan-Li Zhang (Jincheng, China), Zhi-Wei Li (Jincheng, China) and Ya-Jie Niu (JinCheng, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first dir...