US Patent Issued to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. on Jan. 27 for "Camera module having embedded electronic element and steel sheet for improved heat dissipation, and electronic device having the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,720, issued on Jan. 27, was assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. (Shenzhen, China).

"Camera module having embedded electronic element and steel sheet for improved heat dissipation, and electronic device having the same" was invented by Ming-Hsun Lee (New Taipei, Taiwan) and Yi-Wan Wang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board ...