ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,555, issued on Dec. 16, was assigned to Trillion Harvest Ltd. (Anguilla).
"Process method for laser removal of substrate solder mask" was invented by Pei-Chung Pang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A process method for laser removal of substrate solder mask by: providing a substrate with solder pads; covering the substrate and the solder pads with a solder mask, where the part of the solder mask facing the substrate is the shielding part and the part of the solder mask facing the solder pads is the clearing part; using a camera module to read the QR-code for plate production part number on the substrate; automatically ...