ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,558, issued on Sept. 30, was assigned to Transcene Corp. (Tainan, Taiwan).

"Semiconductor chemical mechanical polishing sludge recycling method" was invented by Ya-Min Hsieh (Tainan, Taiwan), Hsin-Hui Chou (Tainan, Taiwan), Hsing-Wen Hsieh (Tainan, Taiwan), Shao-Hua Hu (Tainan, Taiwan), Wen-Ming Cheng (Tainan, Taiwan) and Chin-An Kuan (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a semiconductor chemical mechanical polishing sludge recycling method, which comprises the following steps: (1) drying out the CMP sludge into a condition of solid; (2) putting the solid sludge obtained in step (1) into a h...