US Patent Issued to Toyota Motor Engineering & Manufacturing North America on Sept. 2 for "Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same" (Michigan, Texas Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,296, issued on Sept. 2, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas).

"Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same" was invented by Feng Zhou (Ann Arbor, Mich.), Tianzhu Fan (Houston) and Yanghe Liu (Ann Arbor, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the p...