US Patent Issued to Toyota Motor Engineering & Manufacturing North America on May 13 for "Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating" (Michigan Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,653, issued on May 13, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas).

"Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating" was invented by Feng Zhou (Ann Arbor, Mich.), Yanghe Liu (Ann Arbor, Mich.) and Hiroshi Ukegawa (South Lyon, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on ...