ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,994, issued on Aug. 12, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas).
"Power device embedded printed circuit board assemblies with thin film dielectric layers" was invented by Feng Zhou (Ann Arbor, Mich.), Tianzhu Fan (Houston) and Yanghe Liu (Ann Arbor, Mich.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and th...