US Patent Issued to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA on April 22 for "Power electronics assemblies having power electronics devices embedded within a flip chip" (Michigan Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,792, issued on April 22, was assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC. (Plano, Texas).

"Power electronics assemblies having power electronics devices embedded within a flip chip" was invented by Feng Zhou (Ann Arbor, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power electronics assembly including a circuit board assembly including a plurality of electrically conductive logic layers, a plurality of electrically conductive power layers, and a laminate panel provided between the plurality of electrically conductive logic layers and the plurality of electrically conductive logic layers. The laminate panel includes...