ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,464, issued on Nov. 18, was assigned to TOYOBO Co. LTD. (Osaka, Japan).
"Thermal adhesive laminated oriented film" was invented by Yoshitaka Tanaka (Inuyama, Japan), Shigeyuki Watanabe (Otsu, Japan), Nobuhiro Yoshimura (Otsu, Japan), Ryo Umeki (Otsu, Japan), Takafumi Masuda (Takasago, Japan) and Daiki Funaoka (Nagoya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive...