US Patent Issued to TOYOBO on Nov. 18 for "Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,732, issued on Nov. 18, was assigned to TOYOBO Co. LTD. (Osaka, Japan).

"Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device" was invented by Naoki Watanabe (Otsu, Japan), Harumi Yonemushi (Otsu, Japan), Kousuke Sasai (Otsu, Japan) and Hiroyuki Wakui (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The purpose is to provide a laminate useful as a temporary support for producing a large-area, high-definition flexible electronic device, the laminate having stably low adhesive strength between a colorless and highly transparent polyimide film and an inorganic substrate even in the case of a la...