ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,497, issued on March 25, was assigned to TOYOBO MC Corp. (Osaka, Japan).
"Moisture-curable adhesive composition" was invented by Hideyuki Sakata (Hyogo, Japan) and Kenji Kashihara (Hyogo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin re...