ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,090, issued on Dec. 2, was assigned to TOYO SEIKAN GROUP HOLDINGS LTD. (Tokyo).
"Layered body for packaging" was invented by Seishi Yoshikawa (Yokohama, Japan), Koki Shibata (Yokohama, Japan), Atsushi Ebata (Yokohama, Japan) and Kenya Majima (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The layered body for packaging of the present invention includes a barrier film (1) having an inorganic coating (1b) formed on the surface of a thermoplastic resin film (1a), and an adhesive layer 3 provided on the inorganic coating (1b). The adhesive layer (3) is formed of an epoxy-based adhesive."
The patent was filed on Sept. 10, 2021, under Appl...