ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,465, issued on April 15, was assigned to TOYO ENGINEERING Corp. (Tokyo).
"Heat pump and heat pump unit using same" was invented by Hiroshi Takase (Narashino, Japan), Masaki Togo (Narashino, Japan) and Toshihiro Wakabayashi (Narashino, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Heat pump 10 has heat-absorbing section 12 that receives heat from an outside and heat-releasing section 13 that releases heat to the outside, for transferring heat between heat-absorbing section 12 and heat-releasing sectioning 13 by reinforcing and reducing a magnetic field applied to a primary working fluid circulating between heat-absorbing section 12 and heat-rel...