ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,412, issued on Sept. 9, was assigned to Toyko Electron Ltd. (Tokyo).
"Patterning semiconductor features" was invented by Michael Murphy (Albany, N.Y.), Charlotte Cutler (Albany, N.Y.) and David Conklin (Saratoga Springs, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In certain embodiments, a method includes forming, by photolithography on a semiconductor wafer, first patterned features (PFs) including first photoresist structures (PRSs) having a first width and first recesses having a second width less than the first width and greater than a target width; forming, via anti-spacer patterning processing, second PFs including second PRSs having ...