US Patent Issued to TOYAMA PREFECTURE on Feb. 18 for "Method for joining metal materials and controlling bonding quality thereof" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,226,848, issued on Feb. 18, was assigned to TOYAMA PREFECTURE (Japan).

"Method for joining metal materials and controlling bonding quality thereof" was invented by Hideki Yamagishi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a...