US Patent Issued to TOWA on Oct. 28 for "Resin molding device and method for producing resin molded article" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,082, issued on Oct. 28, was assigned to TOWA Corp. (Kyoto, Japan).

"Resin molding device and method for producing resin molded article" was invented by Fuyuhiko Ogawa (Kyoto, Japan) and Yoshito Okunishi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by mea...