US Patent Issued to TOWA on Jan. 13 for "Resin molding device and method for producing resin molded article" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,926, issued on Jan. 13, was assigned to TOWA Corp. (Kyoto, Japan).

"Resin molding device and method for producing resin molded article" was invented by Yoshito Okunishi (Kyoto, Japan) and Fuyuhiko Ogawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin molding device includes: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of ascending and descending vertically with respect to the side block; a clamp mechanism which clamps the lower mold and the upper mold; a transfer mechanism which supplies a resin material to the cavity by a ...