US Patent Issued to Toto on May 20 for "Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,215, issued on May 20, was assigned to Toto Ltd. (Fukuoka, Japan).

"Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus" was invented by Ryunosuke Nakagawa (Kitakyushu, Japan), Nobutomo Otsuka (Kitakyushu, Japan) and Tatsuya Koga (Kitakyushu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer. The base material includes a first surface, a second surface at a side opposite to the first surface, and at least one hole ...