US Patent Issued to Toto on Feb. 10 for "Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,738, issued on Feb. 10, was assigned to Toto Ltd. (Kitakyushu, Japan).

"Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus" was invented by Ryunosuke Nakagawa (Kitakyushu, Japan) and Tatsuya Koga (Kitakyushu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a composite structure. The composite structure includes a base material and a ceramic layer. The ceramic layer includes a first part located on a surface of the base material and is exposed. The...