ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,266, issued on March 11, was assigned to TOSHIBA TEC K.K. (Tokyo).
"Conductive sheet and sheet bundle package" was invented by Takashi Tomiyama (Sunto Shizuoka, Japan) and Sadatoshi Oishi (Fuji Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive sheet that is configured to be stacked between a sheet tray of an image forming device and a sheet. The conductive sheet includes a base layer and a regulator. The base layer comprises a conductive material. The base layer is configured to be stacked between the sheet tray and the sheet so that the conductive material overlaps with a wireless tag of the sheet. The regulator is config...