US Patent Issued to TORmem on Feb. 25 for "Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor" (California, West Virginia Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,866, issued on Feb. 25, was assigned to TORmem Inc. (San Jose, Calif.).

"Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor" was invented by Steven White (Morgantown, W.va.) and Thao An Nguyen (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-density memory system includes at least one memory-dense compute unit with a printed circuit board ("PCB") having a half-width one rack unit ("1U") form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form fa...