ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,194, issued on Oct. 7, was assigned to TORAY INDUSTRIES Inc. (Tokyo).
"Fiber-reinforced thermoplastic resin substrate" was invented by Kenji Ishitake (Nagoya, Japan), Masayuki Koshi (Nagoya, Japan) and Koki Yoshino (Nagoya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A fiber-reinforced thermoplastic resin substrate has good mechanical properties. The fiber-reinforced thermoplastic resin substrate includes a plurality of continuous reinforcing fibers and a polyphenylene sulfide resin with which the plurality of continuous reinforcing fibers are impregnated, wherein the polyphenylene sulfide resin has a weight average molecular weight of 75,00...