US Patent Issued to TORAY INDUSTRIES on Jan. 28 for "Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,210,285, issued on Jan. 28, was assigned to TORAY INDUSTRIES Inc. (Tokyo).

"Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device" was invented by Keika Hashimoto (Otsu, Japan), Yuki Masuda (Otsu, Japan) and Yuki Takeyama (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be p...