US Patent Issued to TORAY INDUSTRIES on Jan. 27 for "Laminate and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,399, issued on Jan. 27, was assigned to TORAY INDUSTRIES Inc. (Tokyo).

"Laminate and manufacturing method of semiconductor device" was invented by Risano Nakajima (Otsu, Japan), Yukari Arimoto (Otsu, Japan), Mika Koshino (Otsu, Japan), Hitoshi Araki (Otsu, Japan), Masao Tomikawa (Otsu, Japan), Takenori Fujiwara (Otsu, Japan) and Kenta Aoshima (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtain...