ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,803, issued on July 1, was assigned to TORAY ENGINEERING Co. LTD. (Tokyo).
"Mounting device and mounting method" was invented by Katsumi Terada (Otsu, Japan), Kenji Hamakawa (Otsu, Japan), Takashi Hare (Otsu, Japan), Yasushi Tamura (Otsu, Japan), Kensuke Tashima (Otsu, Japan) and Takashi Yoneda (Otsu-shi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates ...