US Patent Issued to Toray Advanced Materials Korea on July 15 for "Copper clad laminate film and electronic device including same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,320, issued on July 15, was assigned to Toray Advanced Materials Korea Inc. (Gyeongsangbuk-do, South Korea).

"Copper clad laminate film and electronic device including same" was invented by Jong Yong Park (Gyeongsangbuk-do, South Korea), Ha Soo Lee (Gyeongsangbuk-do, South Korea) and Jong Hun Cheon (Gyeongsangbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having ...