US Patent Issued to TOPPAN Packaging Americas Holdings on Nov. 11 for "Expandable easy opening dough package" (South Carolina Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,626, issued on Nov. 11, was assigned to TOPPAN Packaging Americas Holdings Inc. (Charlotte, N.C.).

"Expandable easy opening dough package" was invented by Scott William Huffer (Hartsville, S.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An easy opening flexible package and method of making same is provided. The package is suitable for containing raw dough and other products, especially products that create pressure within the package by expansion or by giving off gas such as carbon dioxide."

The patent was filed on Jan. 25, 2019, under Application No. 16/257,501.

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