US Patent Issued to TOPPAN Packaging Americas Holdings on June 3 for "Die cut opening for multi-layer flexible package" (South Carolina, North Carolina Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,485, issued on June 3, was assigned to TOPPAN Packaging Americas Holdings Inc. (Charlotte, N.C.).

"Die cut opening for multi-layer flexible package" was invented by Jacob Donald Prue Branyon (Hartsville, S.C.), Donovan Young (Hartsville, S.C.) and Eugene Smith (Charlotte, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reclosable package is described that includes inner and outer film layers. Each of the inner and outer film layers includes die cuts that are designed to create a peelable flap portion that, when pulled back by the user, reveals an opening of the package for providing access to the contents of the package. In particular, the inne...