US Patent Issued to TOPPAN on Oct. 28 for "Multilayer wiring substrate and module having multilayer wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,697, issued on Oct. 28, was assigned to TOPPAN INC. (Tokyo).

"Multilayer wiring substrate and module having multilayer wiring substrate" was invented by Noriko Kano (Tokyo), Tomoyuki Shirasaki (Tokyo) and Susumu Maniwa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer wiring substrate and a module having the multilayer wiring substrate, wherein the multilayer wiring substrate has a capacitor with a capacitance value smaller than that of the conventional one. The substrate includes a core substrate and capacitors installed therein. At least one of the capacitors is a first capacitor which includes a lower electrode, a dielectric laye...