ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,056, issued on Nov. 4, was assigned to TOPPAN INC. (Tokyo).
"Wiring board manufacturing method and wiring board" was invented by Tomoyuki Ishii (Tokyo), Takehisa Takada (Tokyo) and Yuki Umemura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board manufacturing method including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface toward an opposite surface thereof; a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer; a step C of etching a surfac...