ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,473, issued on June 24, was assigned to TOPPAN INC. (Tokyo).
"Wiring board and method of producing wiring board" was invented by Takeshi Tamura (Tokyo) and Tetsuyuki Tsuchida (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provi...