US Patent Issued to TOPPAN on Dec. 16 for "Resin film, laminate, and packaging body" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,493, issued on Dec. 16, was assigned to TOPPAN INC. (Tokyo).

"Resin film, laminate, and packaging body" was invented by Tokinoya Osamu (Tokyo), Furuta Kaoru (Tokyo) and Kinoshita Kayo (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin film configured to form, together with a gas barrier layer, a laminate for producing a packaging body. The resin film contains polyethylene terephthalate. In a loss tangent curve indicating the relationship between tan Delta and temperature of the resin film, the tan Delta at a peak position is 0.160 or more and 0.190 or less."

The patent was filed on Jan. 3, 2023, under Application No. 18/149,343.

*For fu...