US Patent Issued to Topcon on March 18 for "Three-dimensional survey apparatus, three-dimensional survey method, and three-dimensional survey program" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,601, issued on March 18, was assigned to Topcon Corp. (Tokyo).

"Three-dimensional survey apparatus, three-dimensional survey method, and three-dimensional survey program" was invented by Tadayuki Ito (Tokyo), Yoshihiro Nishi (Tokyo) and Motohiro Miyajima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional survey apparatus includes a collimating ranging unit, a scanner unit, and a control calculation portion. The control calculation portion executes control to acquire, based on a survey result of the collimating ranging unit, three-dimensional data related to a characteristic portion of the measurement object which is present b...