ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,608, issued on Oct. 14, was assigned to TOP TECHNOLOGY LTD (Pyeongtaek-si, South Korea) and SHERKIN TECHNOLOGIES Ltd. (Dublin).
"Process and apparatus for the preparation of a bonded substrate" was invented by Youngho Lee (Yongin-si, South Korea), Yongtae Kim (Yongin-si, South Korea), Sangbae Kim (Hwaseong-si, South Korea) and Donal O'Sullivan (Dublin).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a process and apparatus for the preparation of a bonded substrate. More particularly, the present invention relates to a PDMS bonding apparatus. More specifically, the present invention relates to a PDMS bonding apparatus w...